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Rudolph Technologies to Participate in the Eighth Annual CEO Investor Summit 2016

Accredited investor and publishing research analyst event to be held concurrently with SEMICON West and Intersolar 2016 in San Francisco

Friday, June 24, 2016 6:30 am EDT

Public Company Information:

NYSE:
RTEC

WILMINGTON, Mass.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC), a leading provider of process characterization equipment, lithography equipment and software for wafer fabs and advanced packaging facilities, announced today that Michael P. Plisinski, chief executive officer, will be participating in the Eighth Annual CEO Investor Summit 2016, Wednesday July 13, 2016 in San Francisco, California.

Eighth Annual CEO Investor Summit – July 13, 2016 (San Francisco, CA)
Rudolph Technologies will present at the Eighth Annual CEO Investor Summit 2016 on July 13, 2016. The conference will be held at the W Hotel in San Francisco, CA. The presentation materials utilized during the conference will be made accessible on the investor page of Rudolph Technologies’ website at www.rudolphtech.com.

The CEO Summit is an accredited investor and publishing research analyst event that is held concurrently with SEMICON West and Intersolar 2016 in San Francisco. The event is hosted by executive management from participating companies and will feature a “round-robin” format consisting of small group meetings, each 30 minutes in duration.

The 20 management teams collectively hosting the 2016 CEO Summit include: Axcelis (ACLS), Aehr Test (AEHR), Brooks (BRKS), Camtek (CAMT), Cabot Micro (CCMP), Cohu (COHU), Electro Scientific (ESIO), Exar (EXAR), FormFactor (FORM), inTEST (INTT), Intevac (IVAC), MKS Instruments (MKSI), Nanometrics (NANO), Rudolph (RTEC), Soitec (SOIT), Tessera (TSRA), Tower (TSEM), Ultra Clean (UCTT), Ultratech (UTEK) and Xcerra (XCRA). Sponsors of the event include Cowen & Co and Stifel.

The CEO Investor Summit is by invitation only and is open to accredited investors and publishing research analysts. As space is limited, please RSVP early. Hosts reserve the right to limit attendance as necessary. Last day for registration is July 6, 2016.

While held concurrently with SEMICON West and Intersolar 2016, the event is not affiliated with the show.

To RSVP for the CEO Summit, please contact either of the Summit’s co-chairs.

Laura J. Guerrant-Oiye      

Claire E. McAdams

Guerrant Associates

Headgate Partners LLC

Phone: (808) 882-1467

Phone: (530) 265-9899

Email: lguerrant@guerrantir.com

Email: claire@headgatepartners.com

 

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

Contact:

Rudolph Technologies, Inc.
Investors:
Steven R. Roth, 973-448-4302
Senior Vice President & CFO
steven.roth@rudolphtech.com
or
Guerrant Associates
Laura Guerrant-Oiye, 808-882-1467
Principal
lguerrant@guerrantir.com

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