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Rudolph Technologies To Participate in Investor Conferences

Tuesday, August 28, 2012 7:00 am EDT

Public Company Information:

NASDAQ:
RTEC

FLANDERS, N.J.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (Nasdaq: RTEC), a leading provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, today announced that Paul McLaughlin, Chairman & CEO, and Steven Roth, Sr. VP & CFO, are scheduled to participate in the following investor conferences:

  • 2012 Citi Technology Conference (one-on-one investor meetings) in New York, NY on September 5, 2012. Mr. McLaughlin and Mr. Roth will both be participating in the conference.
  • Deutsche Bank Securities dbAccess 2012 Technology Conference (presentation and one-on-one investor meetings) in Las Vegas, NV on September 11, 2012. The Rudolph Technologies presentation is scheduled for 5:20 p.m. Mr. Roth will be participating in the conference.

Messrs. McLaughlin and Roth will provide an overview of the Company and will discuss its competitive position and future prospects.

For more information, or to arrange a meeting with management, please contact your Citigroup Global Markets contact, your Deutsche Bank Securities contact or Laura Guerrant of Guerrant Associates at lguerrant@guerrantir.com.

The company will post the presentation materials used at each conference on its website. Interested parties may access the presentation via the Company’s investor relations page at www.rudolphtech.com.

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s yield management solutions are used in both the wafer processing and final manufacturing of ICs, as well as in emerging markets such as LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s web site at www.rudolphtech.com.

Contact:

Rudolph Technologies
Steven R. Roth, 973-448-4302
Vice President and CFO
steven.roth@rudolphtech.com
or
Guerrant Associates
Laura Guerrant, 808-882-1467
Principal
lguerrant@guerrantir.com

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